HILLSBORO, Ore. - FEI (Nasdaq:FEIC) announced the release of the next generation of its industry-leading Helios NanoLab(TM) DualBeam(TM). The Helios NanoLab G3 DualBeam extends the Helios family's leadership position with unmatched image contrast and resolution, while at the same time, adding a new, easy-to-use user interface. The new Helios comes in two different workflow-specific configurations for materials science research. It will be featured in the FEI booth at the International Microscopy Congress, September 7-12, in Prague, Czech Republic.

"The Helios NanoLab G3 DualBeam continues FEI's well-established

leadership in DualBeam instrumentation, building on a long history of

performance and innovation from the first commercial DualBeam, which

FEI launched more than 20 years ago, to the Helios PFIB(TM) DualBeam

just announced at the Microscopy and Microanalysis show last month,"

said Trisha Rice, vice president and general manager of Materials

Science for FEI. "This third generation of the Helios family continues

to provide the high resolution and strong image contrast that the

family is known for, but adds a new interface that can actually guide

the user through typical operations. We have optimized each of the

configurations for a particular class of workflows, based on customer

feedback and our long and deep involvement in DualBeam analysis."

The DualBeam instruments' ability to see structure and composition and

add and remove material at the nanometer scale allows materials

scientists to explore fundamental relationships between structure and

function and prepare ultrathin samples for atomic scale analysis in

transmission electron microscopes (TEM).

The CX configuration of the Helios NanoLab G3 DualBeam includes more

versatile sample handling and positioning for fast, flexible analysis,

sample preparation and characterization. The UC configuration delivers

the ultimate imaging capability with increased sensitivity to surface

detail and improved performance on soft, non-conductive or

beam-sensitive materials.

Please visit www.fei.com/helios-g3 for more information, or stop by the

FEI booth (#6) at the International Microscopy Congress.

About FEI

FEI Company (Nasdaq:FEIC) designs, manufactures and supports a broad

range of high-performance microscopy workflow solutions that provide

images and answers at the micro-, nano- and picometer scales. Its

innovation and leadership enable customers in industry and science to

increase productivity and make breakthrough discoveries. Headquartered

in Hillsboro, Ore., USA, FEI has over 2,600 employees and sales and

service operations in more than 50 countries around the world. More

information can be found at: www.fei.com.

FEI Safe Harbor Statement

This news release contains forward-looking statements that include

statements regarding the performance capabilities and benefits of the

Helios NanoLab G3 DualBeam. Factors that could affect these

forward-looking statements include but are not limited to our ability

to manufacture, ship, deliver and install the tools or software as

expected; failure of the product or technology to perform as expected;

unexpected technology problems and challenges; changes to the

technology; the inability of FEI, its suppliers or project partners to

make the technological advances required for the technology to achieve

anticipated results; and the inability of the customer to deploy the

tools or develop and deploy the expected new applications. Please also

refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with

the U.S. Securities and Exchange Commission for additional information

on these factors and other factors that could cause actual results to

differ materially from the forward-looking statements. FEI assumes no

duty to update forward-looking statements.