Eaton Furthers Commitment to Data Center Innovation with Open Compute Project Foundation Membership


Power management company Eaton today announced that it has joined the Open Compute Project (OCP) Foundation, a collaborative community focused on redesigning hardware technology to efficiently support the growing demands on compute infrastructure. As a Community Level Member, Eaton will contribute its power management technology, including its ePDU G3 rack mounted power distribution units (PDUs), to helping the community achieve its mission of designing, using and enabling mainstream delivery of the most efficient designs for scalable computing.

“Eaton has a long-standing record of enabling data center scalability and energy efficiency with our power management hardware, software and services,” said Joe Skorjanec, ePDU product manager, Eaton Distributed Power Solutions. “Through collaboration with the Open Compute community, Eaton’s solutions can play a critical role in this initiative as we continue to power the future of data center innovation.”

Founded in 2011 by Facebook, Intel and Rackspace, OCP reimagines hardware, making it more efficient, flexible and scalable. Through creating global community of technology, leaders are working together to break open the black box of proprietary IT infrastructure to rapidly increase the pace of innovation in, near and around the data center and beyond to achieve greater choice, customization and cost savings.

Eaton’s ePDU G3 portfolio of PDUs provides data center professionals with best-in-class power distribution with a full line of Basic, Metered Input, Metered Outlet and Managed models. The platform offers a variety of capabilities to fulfill IT requirements and serves as a key component of helping data center professionals organize, protect and manage their critical infrastructure.

To learn more about Eaton’s ePDU G3 portfolio, visit Eaton.com/ePDUG3. To learn more about Eaton’s power quality products and services, visit Eaton.com/powerquality.



June 23, 2017


Topic Area: Press Release


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